S&R

Service and Overhaul
electronics

We extend the life cycle of your electronics – professionally and without compromising on quality.

Benefits

Experience that cannot be bought

Since 2004, we have been repairing electronics for global OEM manufacturers. An engineering team with know-how in diagnostics, BGA rework, and programming – the same people, the same address, twenty years of experience.

We repair what others refuse

BGA replacements, complex PCB rework, repairs at the individual component level. Fully air-conditioned ESD operation, specialized rework equipment, 20+ specialists for demanding diagnostics.

Refurbishment as part of sustainable manufacturing

Repaired electronics are more cost-effective than new ones and have a lower environmental impact. We are a partner for automotive and industrial companies that require official refurbished spare parts as an alternative to new production.

Process

How do we bring electronics back to life?

Reception and Diagnostics

Submit defective assemblies with a description of the fault. You will receive a clear analysis – what happened and how we will address it.

Repair and Rework

We repair at the component level – BGA replacements, PCB rework, connector and touch panel replacements.

Testing and Verification

Every repaired assembly undergoes ICT, FCT, and signal tests – the same chain as in serial production. Testing results are included in the documentation.

Refurbishment and Shipping

Refurbished units undergo assembly and customer software installation. We ship with full traceability for every piece.

Technology

Equipment at the level of a manufacturing plant, not a repair shop

We operate the service in the same facilities as serial production. No compromises in technology, no shortcuts in the process.

Diagnostics and Analysis

X-ray inspection, 3D AOI, signal and functional tests, ICT – Keysight, Digitaltest. We identify faults at the component level, not just the assembly level. X-ray also serves as 100% process control for every reworked BGA and QFN component before final testing – including the impact on surrounding components.

Analytical facilities beyond a manufacturing plant

In cooperation with the Department of Microelectronics and the Department of Technology at Brno University of Technology, and with access to the CEITEC infrastructure, we provide analyses that standard repair shops cannot offer externally: scanning electron microscopy (SEM), Dye and Pry testing of BGA solder joints, XRF material analysis of solders and structural components (RoHS, contamination), climatic testing and cycling, cross-sectioning, and tensile testing. The analysis results are included in the repair report or serve as a basis for systemic solutions to recurring defects.

Programming

Off-board and on-board programming, JTAG programming. Automatic installation of customer software on refurbished units as part of the production flow.